ayse kivilcim coskun - cv

Transkript

Ayse K. Coskun
Boston University, Electrical and Computer Engineering Department
8 Saint Mary’s Street, Boston, MA 02215 USA
Phone: 617-358-3641 E-mail: [email protected]
Web: http://people.bu.edu/acoskun/
Google Scholar: http://scholar.google.com/citations?user=euIQ_RkAAAAJ
Education
PhD
Computer Science and Engineering, University of California, San Diego
MS
Computer Science and Engineering, University of California, San Diego
BS
Microelectronics Engineering, Minor Degree in Physics, Sabanci University, Turkey
2009
2006
2003
Research Interests
Green computing, 3D stacked architectures, multi/many-core architectures, temperature and energy management
of computing systems, computer architecture, cyber-physical systems, embedded system design, software.
Work Experience
Boston University, Boston, MA
Assistant Professor in Electrical and Computer Engineering Department
Tenure-track faculty with research, teaching, and service duties.
University of California San Diego, San Diego, CA
Graduate Student Researcher in Computer Science and Engineering Department
Advisor: Prof. Tajana Simunic Rosing
PhD thesis: “Efficient Thermal Management for Multiprocessor Systems”.
September 2009-Present
2003-2009
Sun Microsystems, San Diego, CA (now Oracle)
Intern in Systems Dynamics Characterization and Control Team
2006-2009
Supervisor: Dr. Kenny C. Gross
Conducted research on temperature and reliability modeling / management methods, monitoring real-time
system behavior, and runtime analysis. Contributed to 6 issued and pending patents.
Awards and Grants
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Total amount of research funding raised to date (only Coskun’s share, excluding co-PIs’ budgets and
excluding pending funding applications): $1,137,000.
Advanced Micro Devices (AMD), “Investigation of Phase-Change Material (PCM) for Improvement of Thermal
Efficiency”, 2013-2014, PI (100%), $25,000 (gift).
Sandia National Labs, U.S. Department of Energy, “Intelligent Software Management Strategies”, PI (100%)
o Year 2: 2013-2014. $90,000.
o Year 1: 2012-2013. $83,000.
Oracle Research Award, “Temperature-Aware Workload Scheduling for Optimal Energy Efficiency and
Reliability for Oracle Systems”, PI (100%)
o Year 2: 2013-2014. $95,000 (gift).
o Year 1: 2011-2012. $70,000 (gift).
Department of Energy via Decision Detective Corporation, “Power Management Optimization Platform for
HPC and Data Centers”, 2012-2013. PI (100%), $64,147. Sub-contract as part of an SBIR Phase-II project by
Decision Detective Corporation; total project funding is $1M over two years.
VMware Sponsored Academic Research Award, “Energy-Efficient and Reliable Server Consolidation for the
Cloud”, PI (100%)
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o Year 2: 2012-2013. $75,983 (gift).
o Year 1: 2011-2012. $67,000 (gift).
NSF CAREER Award, “3D Stacked Systems for Energy‐Efficient Computing: Innovative Strategies in
Modeling and Runtime Management”, 2012-2017. PI (100%), $450,000.
Junior Fellow at The Rafik B. Hariri Institute for Computing and Computational Science & Engineering at
Boston University, 2012-2013.
Massachusetts Green High Performance Computing Center (MGHPCC) seed fund, “Designing Green
Software for High Performance Computing Clusters”, 2012-2013. PI (50%), $54,500 (gift).
Best Paper Award, High Performance Embedded Computing (HPEC) Workshop, Sept. 2011.
A. Richard Newton Graduate Scholarship Award, Design Automation Conference (DAC), “3D Systems for
Low-Power High-Performance Computing”, 2011-2012. PI (100%), $24,000 (gift).
Dean’s Catalyst Award at College of Engineering, Boston University, “Green Computing through Software
Optimization”, 2010-2011. PI (50%), $41,280 (gift).
Sun Microsystems (now Oracle) Award, “Performance-aware energy management for parallel workloads”,
2010. PI (100%), amount: $45,000 (gift).
Best Paper Award, IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), October
2009.
UCSD Graduate Student Fellowship, 2003.
Sabanci University Merit Scholarship, 1999-2003.
Teaching Experience
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Boston University, Electrical and Computer Engineering Department
2009-Present
o Introduction to Embedded Systems (EC535) – Spring’10, Spring’11, Spring’12, Spring’13, Fall’13.
 Graduate-level course, technical/track elective for senior undergraduates.
 Substantially re-designed existing course, revised lecture and lab content.
 The lectures survey a broad array of subjects including embedded processors, memory and
communication architecture, real-time operating systems, scheduling, energy efficiency in hardware
and software, hardware-software co-design techniques, and verification techniques.
 The concepts are reinforced with homework and project assignments that involve system design,
modeling and validation. The assignments involve C/Linux programming, ARM/Linux-based evaluation
boards, and optionally other microprocessor or FPGA-based boards.
o Introduction to Software Engineering (EC327) – Fall’10, Fall’11, Fall’12.
 Undergraduate-level course, required for CE students, elective for EE and other engineering students.
 Revised existing course, designed new lab and project assignments.
 The course is an introduction to software design, programming techniques, data structures, and
software engineering principles. The topics include fundamental elements of functional programming
languages, using C/C++ as the case example, principles of object-oriented programming, as embodied
in C++ and Java, and an introduction to elementary data structures and algorithmic analysis.
 Assignments involve programming under Linux/Unix environment as well as the use of an Integrated
Development Environment (Microsoft's Visual Studio). The course also includes an Android app
design project using Java and C++.
o Advanced Computing Systems & Architecture (EC700) – Spring’14.
 Graduate-level (advanced) course.
 Created and designed the course, offered for the first time in Spring’14.
 This class is designed to enable students follow the latest developments in computer systems and
architecture. The lectures cover a broad array of subjects including memory/cache management in
multi-core systems, hardware multi-threading, tiled architectures, heterogeneous systems, large-scale
system architectures, virtualization and hypervisors, data center management, energy awareness in
computing systems, and system reliability/resiliency.
 The concepts are reinforced with research paper readings and also with hands-on homework and
project assignments that involve programming/scripting, system design, and analysis.
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Publications and Patents
*Students primarily advised by Coskun during the course of the project are in bold in the list below.
Book Editorship:
[1] Andreas Burg, Ayse K. Coskun, Matthew R. Guthaus, Srinivas Katkoori, Ricardo Reis (Eds.): “VLSI-SoC:
th
From Algorithms to Circuits and System-on-Chip Design - 20 IFIP WG 10.5/IEEE International Conference
on Very Large Scale Integration, VLSI-SoC 2012, Santa Cruz, CA, USA, October 7-10, 2012, Revised
Selected Papers”. IFIP Advances in Information and Communication Technology 418, Springer 2013.
Book Chapters:
[1] Dhireesha Kudithipudi, Qinru Qiu, and Ayse K. Coskun. “Thermal Management in Many-Core Systems”, in
Evolutionary Based Solutions for Green Computing, pp. 161-185. Editors: J. Kolodziej and S. U. Khan,
Springer-Verlag, New York, USA, 2013.
[2] Ayse K. Coskun, J. Ayala, D. Atienza, T. Simunic Rosing. “Thermal Modeling and Management of LiquidCooled 3D Stacked Architectures”, in VLSI-SoC: Technologies for Systems Integration. Editors: J. Becker, M.
Johann and R. Reis, Springer Publishers, July 2011.
Refereed Journal Publications:
Under review:
[1] Marina Zapater, Ozan Tuncer, Jose Ayala, Jose Moya, Kalyan Vaidyanathan, Kenny Gross, Ayse K.
Coskun. “Leakage-Aware Cooling Management for Improving Server Energy Efficiency". Under review in
IEEE Transactions on Parallel and Distributed Computing, 2013 (submitted).
[2] Tiansheng Zhang, Jie Meng, Ayse K. Coskun. “Dynamic Cache Pooling in 3D Multicore Processors”.
Under review in ACM Journal on Emerging Technologies in Computing Systems, Special Issue on Advances
in Design of Ultra-Low Power Circuits and Systems in Emerging Technologies, 2013 (submitted).
[3] Jie Meng, Eduard Llamos, Fulya Kaplan, Chulian Zhang, Jiayi Sheng, Martin Herbordt, Gunar Schirner,
Ayse K. Coskun. “Joint Optimization of Communication and Cooling Costs in HPC Data Centers”. Under
review in IEEE Transactions on Parallel and Distributed Computing, 2013 (submitted).
[4] Andrea Bartolini, Can Hankendi, Ayse K. Coskun, Luca Benini. “MPI-aware Power Management on the
Single-Chip Cloud Computer”. Under review in ACM Transactions on Embedded Computing (TECS), Special
Issue on Parallel Programming and Runtime Management, 2013 (submitted).
Published / Accepted:
[5] Jie Meng, Samuel McCauley, Fulya Kaplan, Vitus Leung, Ayse K. Coskun. “Simulation and Optimization of
HPC Job Allocation for Reducing Communication and Cooling Costs”. Accepted for publication in Elsevier
Sustainable Computing: Informatics and Systems, 2014.
[6] Priti Aghera, Jinseok Yang, Piero Zappi, Dilip Krishnaswamy, Ayse K. Coskun, Tajana Simunic Rosing.
“Energy Management in Wireless Mobile Systems Using Dynamic Task Assignment”. In ASP Journal of Low
Power Electronics, vol.9, no.2, pp. 198-217(20), August 2013.
[7] Can Hankendi and Ayse K. Coskun. “Autonomous Resource Sharing for Multi-threaded Workloads in
Virtualized Servers”, In VMware Technical Journal, vol 2., no.1, pp. 54-59, June 2013. (invited)
[8] Mohamed M. Sabry, Arvind Sridhar, Jie Meng, Ayse K. Coskun, and David Atienza. “GreenCool: An EnergyEfficient Liquid Cooling Design Technique for 3D MPSoCs Via Channel Width Modulation”. In IEEE
Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol.32, no.4, pp.524-537, April
2013.
[9] Sherief Reda, Ryan Cochran, and Ayse K. Coskun. “Adaptive Power Capping for Servers with Multithreaded Workloads”. IEEE Micro, Special Issue on Energy-Aware Computing, pp. 64-75, Sept.-Oct. 2012.
[10] Mohamed M. Sabry, Ayse K. Coskun, David Atienza, Tajana Simunic Rosing, and Thomas Brunschwiler.
“Energy-efficient Multi-objective Thermal Control for Liquid-Cooled 3D Stacked Architectures. In IEEE
Transactions on Computer Aided Design, vol. 30 no. 12, pp. 1883-1896, Dec. 2011.
[11] Ayse K. Coskun, Jie Meng, David Atienza, and Mohamed M. Sabry. “Attaining Single-Chip, HighPerformance Computing through 3D Systems with Active Cooling”. In IEEE Micro, Special Issue on Big
Chips, pp. 63-73, July-Aug. 2011.
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[12] Ayse K. Coskun, Tajana Rosing and Kenny Gross. “Utilizing Predictors for Efficient Thermal Management in
Multiprocessor SoCs”. In IEEE Transactions on CAD, vol.28 no.10, pp. 1503-1516, Oct. 2009.
[13] Ayse K. Coskun, Tajana Simunic Rosing, Keith Whisnant and Kenny Gross. “Static and Dynamic
Temperature-Aware Scheduling for Multiprocessor SoCs”. In IEEE Transactions on VLSI, vol.16 no.9, pp.
1127-1140, Sept. 2008.
[14] Ayse K. Coskun, Tajana Simunic Rosing, Kresimir Mihic, Yusuf Leblebici and Giovanni De Micheli. “Analysis
and Optimization of MPSoC Reliability”. In Journal of Low Power Electronics (JOLPE), vol.2 no.1, pp.56-69,
April 2006.
Refereed Conference Publications:
[1] Chao Chen, Tiansheng Zhang, Pietro Contu, Jonathan Klamkin, Ayse K. Coskun, and Ajay Joshi. “Sharing
and Placement of On-chip Laser Sources in Silicon-Photonic NoCs”. To appear in Proceedings of
International Symposium on Networks-on-Chip (NOCS), 2014.
[2] Tiansheng Zhang, Jose L. Abellan, Ajay Joshi, Ayse K. Coskun. “Thermal Management of Manycore
Systems with Silicon-Photonic Networks”. In Proceedings of Design Automation and Test in Europe (DATE),
pp. 1-6, 2014.
[3] Hao Chen, Michael Caramanis, Ayse K. Coskun. “The Data Center as a Grid Load Stabilizer”. In
Proceedings of the Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 105-112, January
2014. (invited- special session)
[4] Hao Chen, Ayse K. Coskun, Michael Caramanis. “Real-Time Power Control of Data Centers for Providing
Regulation Service”, In Proceedings of the Conference on Decision and Control (CDC), pp. 4314-4321,
December 2013.
[5] Hao Chen, Can Hankendi, Michael Caramanis, Ayse K. Coskun. “Dynamic Server Power Capping for
Enabling Data Center Participation in Power Markets”, In Proceedings of International Confrence on
Computer Aided Design (ICCAD), pp. 122-129, November 2013.
[6] Jie Meng, Tiansheng Zhang, and Ayse K. Coskun. “Dynamic Cache Pooling for Improving Energy
Efficiency in 3D Stacked Multicore Processors”. In Proceedings of the IFIP/IEEE International Conference on
Very Large Scale Integration (VLSI-SoC), pp. 210-215, 2013.
[7] Can Hankendi, Sherief Reda, and Ayse K. Coskun. “vCap: Adaptive Power Capping for Virtualized
Servers”. In Proceedings of ACM International Symposium on Low Power Electronics and Design (ISLPED),
pp. 415-420, Sept. 2013.
[8] Fulya Kaplan, Jie Meng and Ayse K. Coskun. “Optimizing Communication and Cooling Costs in HPC Data
Centers via Intelligent Job Allocation”, In Proceedings of International Green Computing Conference (IGCC),
pp. 1-10, June 2013.
[9] Can Hankendi and Ayse K. Coskun. “Energy-Efficient Server Consolidation for Multi-threaded Applications
in the Cloud”, In Proceedings of International Green Computing Conference (IGCC) - WiP, pp. 1-8, June
2013.
[10] David Mace, Wei Gao, and Ayse K. Coskun. “Accelerometer-Based Hand Gesture Recognition using
Feature Weighted Naïve Bayesian Classifiers and Dynamic Time Warping”. In ACM International Conference
on Intelligent User Interfaces (IUI), pp. 83-84, 2013.
[11] Tiansheng Zhang, Alessandro Cevrero, Giulia Beanato, Panagiotis Athanasopoulos, Ayse K. Coskun and
Yusuf Leblebici. “3D-MMC: A Modular 3D Multi-Core Architecture with Efficient Resource Pooling”. In
Proceedings of Design Automation and Test in Europe (DATE), pp. 1241-1246, 2013.
[12] Marina Zapater, José L. Ayala, José M. Moya, Kalyan Vaidyanathan, Kenny Gross, and Ayse K. Coskun.
“Leakage and Temperature Aware Server Control for Improving Energy Efficiency in Data Centers”. In
[13] Jie Meng, Fulya Kaplan, Mingyu Hsieh, and Ayse K. Coskun. “Topology-Aware Reliability Optimization for
Multiprocessor Systems”. In Proceedings of IFIP/IEEE International Conference on Very Large Scale
Integration (VLSI-SoC), pp. 243-248, 2012.
[14] Jie Meng, Katsutoshi Kawakami, and Ayse K. Coskun. “Optimizing Energy Efficiency of 3D Multicore
Systems with Stacked DRAM under Power and Thermal Constraints”. In Proceedings of Design Automation
Conference (DAC), pp. 648-655, 2012.
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[15] Ming-Yu Hsieh, Jie Meng, Michael Levenhagen, Kevin Pedretti, Ayse K. Coskun, and Arun Rodrigues. “SST
+ gem5 = A Scalable Simulation Infrastructure for High Performance Computing”. In 5th International ICST
Conference on Simulation Tools and Techniques (SIMUTools), pp. 196-201, 2012.
[16] Jie Meng and Ayse K. Coskun. “Analysis and Runtime Management of 3D Systems with Stacked DRAM for
Boosting Energy Efficiency”. In Proceedings of Design Automation and Test in Europe (DATE), pp. 611-616,
2012.
[17] Andrea Bartolini, MohammadSadegh Sadri, John-Nicholas Furst, Ayse K. Coskun, and Luca Benini.
“Quantifying the Impact of Frequency Scaling on the Energy Efficiency of the Single-Chip Cloud Computer”. In
[18] Can Hankendi and Ayse K. Coskun. “Reducing the Energy Cost of Computing through Efficient CoScheduling of Parallel Workloads”. In Proceedings of Design Automation and Test in Europe (DATE), pp.
994-999, 2012.
[19] Ryan Cochran, Can Hankendi, Ayse K. Coskun, and Sherief Reda. “Pack & Cap: Adaptive DVFS and
Thread Packing Under Power Caps”. In 44th Annual IEEE/ACM International Symposium on
Microarchitecture (MICRO-44), pp. 175-185, 2011.
[20] Ryan Cochran, Can Hankendi, Ayse K. Coskun, and Sherief Reda. “Identifying the Optimal Energy-Efficient
Operating Points of Parallel Workloads”. In Proceedings of International Conference on Computer-Aided
Design (ICCAD), pp. 608-615, 2011.
[21] Chao Chen, Jie Meng, Ayse K. Coskun, and Ajay Joshi. “Express Virtual Channels with Taps (EVC-T): A
Flow Control Technique for Network-on-Chip (NoC) in Manycore Systems”. In IEEE Hot Interconnects,
Annual Symposium on High-Performance Interconnects, pp. 1-10, 2011.
[22] Jie Meng, Chao Chen, Ayse K. Coskun, and Ajay Joshi. “Run-time Energy Management of Manycore
Systems through Reconfigurable Interconnects”. In Proceedings of ACM Great Lakes Symposium on VLSI
(GLSVLSI), pp. 43-48, 2011.
[23] Mohamed M. Sabry, David Atienza, and Ayse K. Coskun. “Thermal Analysis and Active Cooling
Management for 3D MPSoCs”. In Proceedings of IEEE International Symposium on Circuits and Systems
(ISCAS), pp. 2237-2240, 2011.
[24] Mohamed Sabry, Ayse K. Coskun, and David Atienza. “Fuzzy Control for Enforcing Energy Efficiency in
High-Performance 3D Systems”. In Proceedings of International Conference on Computer Aided Design
(ICCAD), pp. 642-648, 2010.
[25] Ayse K. Coskun, David Atienza, Tajana Rosing, Thomas Brunschwiler, and Bruno Michel. “Energy-Efficient
Variable-Flow Liquid Cooling in 3D Stacked Architectures”. In Proceedings of Design Automation and Test in
Europe (DATE), pp. 1-6, 2010.
[26] Priti Aghera, Dilip Krishnaswamy, Diana Fang, Ayse K. Coskun, and Tajana Rosing. “DynAHeal: Dynamic
Energy Efficient Task Assignment for Wireless Healthcare Systems”. In Proceedings of Design Automation
and Test in Europe (DATE), pp. 1661-1664, 2010.
[27] Shervin Sharifi, Ayse K. Coskun, and Tajana Simunic Rosing, "Hybrid Dynamic Energy and Thermal
Management in Heterogeneous Embedded Multiprocessors". In IEEE Asia South Pacific Design Automation
Conference (ASPDAC), pp. 873-878, 2010.
[28] Ayse K. Coskun, Tajana Simunic Rosing, Jose Ayala, and David Atienza. “Modeling and Dynamic
Management of 3D Multicore Systems with Liquid Cooling”. In Proceedings of the IFIP/IEEE International
Conference on Very Large Scale Integration (VLSI-SoC), pp. 60-65, 2009. Best Paper Award.
[29] Francesco Zanini, Ayse K. Coskun, David Atienza and Giovanni De Micheli. “Optimal Multi-Processor SoC
Thermal Simulation via Adaptive Differential Equation Solvers”. In Proceedings of the IFIP/IEEE International
Conference on Very Large Scale Integration (VLSI-SoC), pp. 80-85, 2009.
[30] Ayse K. Coskun, Andrew B. Kahng, and Tajana Rosing. “Temperature- and Cost-Aware Design of 3D
Multiprocessor Architectures”. In Proceedings of the Euromicro Conference on Digital System Design (DSD),
pp. 183-190, 2009.
[31] Ayse K. Coskun, Richard Strong, Dean Tullsen and Tajana Rosing. “Evaluating the Impact of Job
Scheduling and Power Management on Processor Lifetime for Chip Multiprocessors”. In Proceedings of the
ACM SIGMETRICS/Performance, pp. 169-180, 2009.
[32] Ayse K. Coskun, Jose Ayala, David Atienza, Tajana Rosing, and Yusuf Leblebici. “Dynamic Thermal
Management in 3D Multicore Architectures”. In Proceedings of Design Automation and Test in Europe
(DATE), 2009.
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[33] Ayse K. Coskun, Tajana Rosing, and Kenny Gross. “Proactive Temperature Balancing for Low Cost Thermal
Management in MPSoCs”. In Proceedings of International Conference on Computer Aided Design (ICCAD),
pp. 250-257, 2008.
[34] Ayse K. Coskun, Tajana Rosing and Kenny Gross. “Proactive Thermal Management in MPSoCs”. In
Proceedings of ACM International Symposium on Low Power Electronics and Design (ISLPED), pp. 165-170,
2008.
[35] Ayse K. Coskun, Tajana Rosing and Kenny Gross. “Temperature Management in Multiprocessor SoCs
Using Online Learning”. In Proceedings of ACM Design Automation Conference (DAC), pp. 890-893, 2008.
[36] Ayse K. Coskun, Tajana Rosing, Keith Whisnant, and Kenny Gross. “Temperature-Aware MPSoC
Scheduling for Reducing Hot Spots and Gradients”. In Proceedings of IEEE Asia South Pacific Design
Automation Conference (ASPDAC), pp. 49-54, 2008.
[37] Ayse K. Coskun, Tajana Rosing and Keith Whisnant. “Temperature Aware Task Scheduling in MPSoCs”. In
Proceedings of ACM Design Automation and Test in Europe (DATE), pp. 1659-1664, 2007.
[38] Satish Narayanasamy, Ayse K. Coskun and Brad Calder. “Predicting Faults Based on Anomalies in
Speculative Execution”. In Proceedings of ACM Design Automation and Test in Europe (DATE), pp. 11401145, 2007.
[39] Ayse K. Coskun, Tajana Rosing, Yusuf Leblebici, and Giovanni De Micheli. “A Simulation Methodology for
Reliability Analysis for Multi-Core SoCs”. In Proceedings of ACM Great Lakes Symposium on VLSI
(GLSVLSI), pp. 95-99, 2006.
Refereed Workshop Publications:
[1] Can Hankendi and Ayse K. Coskun. “Adaptive Power and Resource Management Techniques for Multithreaded Workloads”. In Proceedings of IEEE International Parallel and Distributed Processing Symposium –
Workshops and PhD Forum, pp. 2302-2305, 2013.
[2] David Mace, Wei Gao, and Ayse K. Coskun. “Improving Accuracy and Practicality of Accelerometer-Based
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Hand Gesture Recognition”. In 2 Workshop on Interacting with Smart Objects, in conjunction with the ACM
International Conference on Intelligent User Interfaces (IUI), 2013.
[3] Can Hankendi and Ayse K. Coskun. “Adaptive Energy-Efficient Resource Sharing for Multi-threaded
Workloads in Virtualized Systems”. In International Workshop on Computing in Heterogeneous, Autonomous
‘N’ Goal-Oriented Environments (CHANGE), in conjunction with Design Automation Conference (DAC), 2012.
[4] John-Nicholas Furst and Ayse K. Coskun. “Performance and Power Analysis of RCCE Message Passing
on the Intel Single-Chip Cloud Computer”. In 4th symposium of the Many-core Applications Research
Community (MARC), December 2011.
[5] Jie Meng, Daniel Rossell, and Ayse K. Coskun. “3D Systems with On-Chip DRAM for Enabling Low-Power
High-Performance Computing”. In Proceedings of the High Performance Embedded Computing (HPEC)
Workshop, 2011. Best Paper Award.
[6] Md. Ashfaquzzaman Khan, Can Hankendi, Ayse K. Coskun, and Martin C. Herbordt. “Application Level
Optimizations for Energy Efficiency and Thermal Stability”. In Proceedings of the High Performance
Embedded Computing (HPEC) Workshop, 2011.
[7] Jie Meng, Daniel Rossell, and Ayse K. Coskun. “Exploring performance, power, and temperature
characteristics of 3D systems with on-chip DRAM”. In Proceedings of IEEE International Workshop on
Thermal Modeling and Management: From Chips to Data Centers (TEMM) –in conjunction with Green
Computing Conference (IGCC), 2011.
[8] Md. Ashfaquzzaman Khan, Can Hankendi, Ayse K. Coskun and Martin C. Herbordt. “Software Optimization
for Performance, Energy, and Thermal Distribution: Initial Case Studies”. In Proceedings of IEEE International
Workshop on Thermal Modeling and Management: From Chips to Data Centers (TEMM) –in conjunction with
Green Computing Conference (IGCC), 2011.
Other:
[1] Columnist for the Circuit Cellar magazine, writing a bi-monthly column on Green Computing, 2013-present.
[2] Ayse K. Coskun and Tajana Simunic Rosing. “Improving Energy Efficiency and Reliability through Workload
Scheduling in High-Performance Multicore Processors”. Dac.Com Knowledge Center Article, 2010.
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Patents:
[1] David Belanger, Ayse K. Coskun, Kenny C. Gross, Kalyan Vaidyanathan. “System and Method for
Controlling Energy Usage in a Server”. Pending, Filed 01/2010.
[2] Kenny Gross, Ayse K. Coskun, Keith Whisnant and Aleksey M. Urmanov. “Method and Apparatus for
Controlling Temperature Variations in a Computer System”. U.S. Patent 8,046,112. Issued 11/2011.
[3] Ayse K. Coskun and Kenny Gross. “Managing the Performance of a Computer System”. U.S. Patent
7,890,298. Issued 02/ 2011.
[4] Ayse K. Coskun, Aleksey M. Urmanov, Kenny Gross and Keith Whisnant. “Workload Scheduling in MultiCore Processors”. U.S. Patent 7,716,006. Issued 05/2010.
[5] Kenny Gross, Keith Whisnant and Ayse K. Coskun. “Length-of-the-Curve Stress Metric for Improved
Characterization of Computer System Reliability”. U.S. Patent 7,483,816. Issued 01/2009.
[6] Ayse K. Coskun, Kenny Gross and Keith Whisnant. “Temperature-Aware and Energy-Aware Scheduling in a
Computer System”. Pending, Filed 10/2007.
Theses (Supervised / Published):
 Jie Meng, PhD, Boston University, ECE Department, “Modeling and Optimization of High-Performance ManyCore Systems for Energy-Efficient and Reliable Computing”, 2013.
 Ayse K. Coskun, PhD, University of California San Diego (UCSD), CSE Department, “Efficient Thermal
Management of Multiprocessor Systems”, 2009.
Academic Service and Memberships
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Conference organization:
o General co-chair, ACM Great Lakes Symposium on VLSI (GLSVLSI), 2016.
o Program chair, ACM Great Lakes Symposium on VLSI (GLSVLSI), 2015.
o Track Chair for Application Design, Design Automation and Test in Europe (DATE), 2015.
o Topic chair (Green Computing Systems), Design Automation and Test in Europe (DATE), 2014.
o Topic co-chair (Green Computing Systems), Design Automation and Test in Europe (DATE), 2012-2013.
o Proceedings chair, ACM Great Lakes Symposium on VLSI (GLSVLSI), 2013.
o Local participation chair, IEEE International Parallel & Distributed Processing Symposium (IPDPS) 2013.
o Program chair, IFIP/IEEE International Conference on Very Large Scale Integration (VLSISoC), 2012.
o Workshop program co-chair, International Workshop on Adaptive Power Management with Machine
Intelligence (APMMI), in conjunction with ICCAD'11.
o Workshop co-chair, Thermal modeling and Management: Chips to Datacenters Workshop, in conjunction
with IEEE International Green Computing Conference (IGCC), 2011.
o Special session co-chair, IFIP/IEEE VLSISoC 2010.
Technical program committee membership:
o IEEE/ACM International Conference on Computer Aided Design (ICCAD) 2014.
o ACM/IEEE Design Automation Conference (DAC) 2012-2014.
o IEEE International Parallel and Distributed Processing Symposium (IPDPS) 2013-2014.
o IEEE International Conference on Computer Design (ICCD) 2012-2013
o IFIP/IEEE VLSISoC 2011, 2013.
o ACM Great Lakes Symposium on VLSI (GLSVLSI) 2010-2014.
o International Workshop on Power and Timing Modeling, Optimization and Simulation (PATMOS) 2011
o Power-Aware Design and Optimization (PADO) Track at the ACM Symposium on Applied Computing
(SAC) 2010-2011
Executive Committee member and Secretary for IEEE Council on Electronic Design Automation (CEDA), Jan.
2014-present.
Editorship:
o Associate Editor, IEEE Embedded Systems Letters, 2013-present.
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Guest editor for ACM Transactions on Design Automation of Electronic Systems (TODAES), Special
Issue on Adaptive Power Management for Energy and Temperature Aware Computing Systems, 2012.
Reviewer for a number of journals such as IEEE Transactions on VLSI, IEEE Transactions on CAD, IEEE
Transactions on Embedded Systems, IEEE Transactions on Parallel and Distributed Systems, and for
conferences such as ISCA and MICRO.
IEEE and ACM member.
Recent Invited Talks and Tutorials
(This list excludes conference paper presentations)
[1] “Temperature and Workload Awareness for Achieving Energy Efficiency in Servers and Data Centers”, Oracle
Labs, Belmont, CA, 6.3.2014.
[2] “Temperature and Workload Awareness for Achieving Energy Efficiency in Servers and Data Centers”,
Oracle, Santa Clara, CA, 6.2.2014.
[3] “Application-Aware Power Capping and Budgeting: From Servers to Data Centers”, International Workshop
on Computing in Heterogeneous, Autonomous ‘N’ Goal-Oriented Environments (CHANGE), in conjunction
with Design Automation Conference (DAC), San Francisco, CA, 06.01.2014.
[4] “3D Stacking as an Enabler for Low-Power High-Performance Computing”, TechTalk at the Intersociety Conf.
on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), Orlando, FL, 5.27.2014.
[5] “Towards Sustainable Computing: Innovative Design and Management Strategies Across the Computing
Stack”, Princeton University, Princeton, NJ, 3.31.2014.
Stack”, University of Massachusetts, Amherst, MA, 3.3.2014.
[7] “The Data Center as a Grid Load Stabilizer”, California Institute of Technology (Caltech), Pasadena, CA,
2.21.2014.
Stack”, University of Texas, Austin, TX, 2.10.2014.
[9] “Real-Time Power Control of Data Centers for Providing Regulation Service”, Lawrence Berkeley National
Laboratory (LBL), Berkeley, CA, 11.19.2013.
Stack”, WPI, Worcester, MA, 11.14.2013.
Stack”, Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, VA, 11.1.2013.
[12] “Job Allocation Methods to Optimize Communication and Cooling Costs in HPC Data Center”, INFORMS,
Minneapolis, MN, 10.6.2013.
[13] “3D Stacking as an Enabler for Low-Power High-Performance Computing”, Advanced Micro Devices (AMD),
Boxborough, MA, 9.9.2013.
Stack”, IBM T.J. Watson Research Center, Yorktown Heights, NY, 8.19.2013.
[15] “3D Stacking as an Enabler for Low-Power High-Performance Computing”, D43D: 5th Design for 3D Silicon
Integration Workshop, Grenoble, France, 6.27.2013.
[16] “Novel Architectures Enabled by 3D Stacking”, ASME International Technical Conference and Exhibition on
Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Panel, San Francisco, CA,
7.16.2013.
[17] “Adaptive Power Capping and Resource Management Methods for Multi-Core Servers”, Intel, Portland, OR,
6.17.2013.
[18] “Avoiding Core Meltdown! - Adaptive Techniques for Power and Thermal Management of Multi-Core
Processors”, Tutorial at the Design Automation Conference (DAC) (with Sherief Reda, Charles Lefurgy,
Ibrahim Elfadel), Austin, TX, 6.3.2013.
[19] “Autonomous Resource Pooling for Improving Energy Efficiency”, International Workshop on Computing in
Heterogeneous, Autonomous ‘N’ Goal-Oriented Environments (CHANGE), in conjunction with Design
Automation Conference (DAC), Austin, TX, 06.02.2013.
[20] “Adaptive Power Capping and Efficient Consolidation for Virtualized Servers”, VMware, Cambridge, MA,
5.28.2013.
8
[21] “Towards Sustainable Computing: Innovative Design and Management Strategies across the Computing
Stack”, Distinguished Lecture at Boston University Hariri Institute of Computing, Boston, MA, 2.13.2013.
[22] “Energy-Efficient Server Management for HPC Clusters”, VMware, Cambridge, MA, 2.20.2013.
[23] “Energy-Efficient and Reliable Server management in the Cloud”, VMware Academic Research Symposium,
Cambridge, MA, 9.27.2012.
[24] “Thermal-Aware and Energy-Aware Workload Scheduling Research for Oracle Servers”, Oracle Power
Management Summit, Burlington, MA, 9.26.2012.
[25] “Temperature-Aware Workload Scheduling for Optimal Energy Efficiency and Reliability of Oracle Systems”,
Oracle, San Diego, CA, 8.1.2012.
[26] “Embedded Systems and Energy-Efficient Computing”, Artemis Summer School at BU, MA, 7.19.2012.
[27] “Efficient Thermal Management Strategies for 3D Stacked Multicore Systems”, Tutorial, D43D: 4th Design
for 3D Silicon Integration Workshop, Lausanne, Switzerland, 6.27.2012.
[28] “Temperature-Aware Computing: Achievements and Remaining Challenges”, Tutorial (with Dhireesha
Kudithipudi, Sherief Reda, and Qinru Qiu), International Green Computing Conference (IGCC), San Jose, CA,
6.8.2012.
[29] “Adaptive Energy-Efficient Resource Sharing for Multi-Threaded Workloads in Virtualized Systems”, VMware,
Palo Alto, CA, 6.4.2012.
[30] “Adaptive Energy and Reliability Management Strategies for Computing Clusters”, VMware Cambridge, MA,
2.29.2012.
[31] “Attaining Single-Chip High-Performance Computing Through 3D Stacking”, Tufts University, Medford, MA,
organized by IEEE Women in Engineering & Boston Section Education Society, 2.21.2012.
[32] “Modeling and Management Techniques for Energy Efficiency and Reliability in Multiprocessor Systems”,
SIAM Conference on Parallel Processing for Scientific Computing (PP12), Savannah, GA, 2.15.2012.
[33] “Energy-Efficient and Reliable System Management and Resource Consolidation”, VMware Cambridge, MA,
1.30.2012.
[34] “Runtime Management and Consolidation of Servers for Energy-Efficient and Reliable Operation”, VMware
Palo Alto, CA, 11.11.2011.
[35] “Attaining Single-Chip High-Performance Computing Through 3D Stacking”, IBM Zurich Research
Laboratories, 11.4.2011.
[36] “Attaining Single-Chip High-Performance Computing Through 3D Stacking”, WPI, Worcester, MA,
10.12.2011.
[37] “Embedded Systems and Energy-Efficient Computing”, Artemis Summer School at BU, MA, 7.21.2011.
[38] “Software-Level Thermal Management for High-Performance Architectures”, Microscale Heat Transfer
Summer School, Ecole Polytechnique Fédérale de Lausanne (EPFL), Switzerland, 6.10.2011.
[39] “Efficient Evaluation and Management of Temperature and Reliability in Multiprocessor Systems”, Sandia
National Laboratories – Computer Science Research Institute, Albuquerque, NM, 4.21.2011.
[40] “Optimizing the Software Stack for Energy-Efficient Computing”, Center for Computational Science, Boston
University, Boston, MA, 3.04.2011.
[41] “Energy-Efficient Thermal Management for High-Performance Multiprocessor Systems”, IBM Austin Research
Center, Austin, TX, 12.2.2010.
[42] “Intelligent Runtime Management for Enabling Energy-Efficient, Reliable, and High-Performance Computing”,
Oracle, Menlo Park, CA, 11.11.2010.
[43] “Manufacturing, CAD and Thermal-Aware Architectures for 3-D MPSoCs”, Tutorial, International Conference
on Computer Aided Design (ICCAD), San Jose, CA, 11.10.2010.
[44] “Energy-Efficient Temperature Management for High Performance Multiprocessor Systems”, IBM T.J. Watson
Research Center, Yorktown Heights, NY, 8.9.2010.
nd
[45] “3D Thermal Control Techniques”, Tutorial, D43D: 2 Design for 3D Silicon Integration Workshop, Ecole
Polytechnique Fédérale de Lausanne (EPFL), Switzerland, 5.26.2010.
[46] “Energy-Efficient Temperature Management Techniques for High Performance Multiprocessor Systems”,
Brown University, RI, 4.12.2010.
[47] “Thermal Modeling and Management for 2D and 3D Multiprocessor System-on-Chip”, Tutorial (with David
Atienza and Jose Ayala), International Conference on VLSI Design, India, 1.4.2010.
9

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